Patent Assignment
Reel/Frame 064499/0937
Assignment of Assignor's Interest
Recorded: 2023-08-04
Pages: 3
Assignors
LEE, YONGSEOK
Executed: 2023-05-08
MOON, HEECHEUL
Executed: 2023-05-08
PARK, SUNGYONG
Executed: 2023-05-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Comprising Heat Dissipation Structure
Application:
18/230,517 →
Publication:
US 2023/0380111