Patent Assignment
Reel/Frame 064516/0487
Assignment of Assignor's Interest
Recorded: 2023-08-08
Pages: 6
Assignors
KIM, JUHYEON
Executed: 2023-02-20
KIM, YEONGSEON
Executed: 2023-02-17
SEO, SUNKYOUNG
Executed: 2023-02-17
JO, CHAJEA
Executed: 2023-02-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having First Pad and Second Pad
Application:
18/231,102 →
Publication:
US 2024/0113057