Patent Assignment
Reel/Frame 064527/0475
Assignment of Assignor's Interest
Recorded: 2023-08-08
Pages: 7
Assignors
TEYSSEYRE, JEROME
Executed: 2023-07-19
JEON, OSEOB
Executed: 2023-08-03
CHEW, CHEE HIONG
Executed: 2023-07-05
IM, SEUNGWON
Executed: 2023-07-03
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Transfer Molded Power Modules and Methods of Manufacture
Application:
18/345,308 →
Publication:
US 2024/0030108