Patent Assignment
Reel/Frame 064559/0184
Assignment of Assignor's Interest
Recorded: 2023-08-11
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method
Application:
18/448,220 →
Publication:
US 2025/0054926