Patent Assignment
Reel/Frame 064609/0486
Assignment of Assignor's Interest
Recorded: 2023-08-16
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Vertical Semiconductor Package Including Horizontally Stacked Dies and Methods of Forming the Same