Patent Assignment
Reel/Frame 064611/0482
Assignment of Assignor's Interest
Recorded: 2023-08-16
Pages: 7
Assignors
IM, SEUNGWON
Executed: 2023-06-30
JEON, OSEOB
Executed: 2023-08-15
KIM, JIHWAN
Executed: 2023-06-30
KANG, DONGWOOK
Executed: 2023-07-03
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Transfer Molded Power Modules and Methods of Manufacture
Application:
18/354,863 →
Publication:
US 2024/0055334