Patent Assignment
Reel/Frame 064651/0941
Assignment of Assignor's Interest
Recorded: 2023-08-21
Pages: 3
Assignors
CHANG, MENG-SHENG
Executed: 2023-08-08
HUANG, CHIA-EN
Executed: 2023-08-08
YANG, I-HSIN
Executed: 2023-08-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Device, Memory Device, and Method of Manufacturing
Application:
18/452,973 →
Publication:
US 2024/0334689