Patent Assignment
Reel/Frame 064952/0369
Assignment of Assignor's Interest
Recorded: 2023-09-19
Pages: 6
Assignors
KIM, JONGMIN
Executed: 2023-09-06
SONG, HO-JU
Executed: 2023-09-06
LEE, MYEONG-DONG
Executed: 2023-09-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
18/469,791 →
Publication:
US 2024/0324181