Patent Assignment
Reel/Frame 064976/0937
Assignment of Assignor's Interest
Recorded: 2023-09-20
Pages: 5
Assignor
YAMAZAKI, HIROHISA
Executed: 2023-08-01
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Method, Method of Manufacturing Semiconductor Device, Non-Transitory Computer-Readable Recording Medium and Substrate Processing Apparatus
Application:
18/471,239 →
Publication:
US 2024/0105461