Patent Assignment
Reel/Frame 065059/0744
Assignment of Assignor's Interest
Recorded: 2023-09-28
Pages: 4
Assignor
CAMPBELL, COLIN
Executed: 2023-09-27
Assignee
STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
ATLAS HOUSE, THIRD AVENUE, GLOBE PARK, MARLOW, SL7 1EY, UNITED KINGDOM
Covered Property
(1)
Module Packaging Architecture to Reduce Crosstalk in an Optical Sensor
Application:
18/476,551 →
Publication:
US 2025/0109983
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 28, 2023
From: RITCHIE, CALUM; FISSORE, MATTEO
To: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
Reel/Frame 065059/0641 →
Assignment of Assignor's Interest
Apr 9, 2024
From: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 067051/0721 →