Patent Assignment
Reel/Frame 065077/0497
Assignment of Assignor's Interest
Recorded: 2023-09-29
Pages: 4
Assignors
GUHA, BISWAJEET
Executed: 2023-08-16
MANFRINI, MAURICIO
Executed: 2023-08-14
SATO, NORIYUKI
Executed: 2023-08-14
CLARKSON, JAMES DAVID
Executed: 2023-08-14
FERNANDEZ, ABEL
Executed: 2023-08-14
RATHI, SOMILKUMAR J.
Executed: 2023-08-14
MUKHERJEE, NILOY
Executed: 2023-08-12
GOSAVI, TANAY
Executed: 2023-08-22
MATHURIYA, AMRITA
Executed: 2023-08-12
DOKANIA, RAJEEV KUMAR
Executed: 2023-08-22
MANIPATRUNI, SASIKANTH
Executed: 2023-09-28
Assignee
KEPLER COMPUTING INC.
180 STEUART STREET, #19254, SAN FRANCISCO, CALIFORNIA, 94105
Covered Property
(1)
Method of Forming Stacked Capacitors Through Wafer Bonding
Application:
18/448,852 →
Publication:
US 2024/0274651