Patent Assignment
Reel/Frame 065196/0491
Assignment of Assignor's Interest
Recorded: 2023-10-12
Pages: 4
Assignors
SHEN, HSIANG-KU
Executed: 2023-05-04
HSIAO, CHUN-WEN
Executed: 2023-05-15
CHIH, FANG-I
Executed: 2023-06-05
CHANG, WEN-LING
Executed: 2023-05-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structures and Methods of Forming the Same
Application:
18/313,853 →
Publication:
US 2024/0379595