IP Library Assignment 065277/0764
Patent Assignment
Reel/Frame 065277/0764

Assignment of Assignor's Interest

Recorded: 2023-10-19 Pages: 3
Assignors
PENG, CHENG-YI
Executed: 2020-06-24
LEE, SONG-BOR
Executed: 2020-03-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Core-Shell Nanostructures For Semiconductor Devices
Application: 18/232,272 →
Publication: US 2023/0411455