Patent Assignment
Reel/Frame 065299/0453
Assignment of Assignor's Interest
Recorded: 2023-10-20
Pages: 4
Assignors
TIO MEDINA, GUIU
Executed: 2021-04-20
GONZALEZ MARTIN, SERGIO
Executed: 2021-04-20
ROCA VILA, JORDI
Executed: 2021-04-20
Assignee
HP PRINTING AND COMPUTING SOLUTIONS, S.L.U.
CALLE JOSE ECHEGARAY, 18, PARQUE EMPRESARIAL, LAS ROZAS-MADRID, 28232, SPAIN
Covered Property
(1)
Assembly Packing in 3D Printing
Application:
18/287,854 →
Publication:
US 2024/0202383
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 20, 2023
From: HP PRINTING AND COMPUTING SOLUTIONS, S.L.U.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 065299/0489 →
Assignment of Assignor's Interest
Feb 11, 2025
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: PERIDOT PRINT LLC
Reel/Frame 070187/0001 →