Patent Assignment
Reel/Frame 065375/0932
Assignment of Assignor's Interest
Recorded: 2023-10-27
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Wafer Dicing and Manufacturing Method of Semiconductor Devices Using the Same
Application:
18/496,531 →
Publication:
US 2024/0290658