IP Library › Assignment 065379/0063
Patent Assignment
Reel/Frame 065379/0063

Assignment of Assignor's Interest

Recorded: 2023-10-29 Pages: 4
Assignor
II-VI INCORPORATED
Executed: 2019-12-02
Assignee
II-VI DELAWARE, INC.
1100 NORTH MARKET STREET, 4TH FLOOR, WILMINGTON, DELAWARE, 19890
Covered Property (1)
Method of Forming a Multilayer Substrate Comprising a Layer of Silicon and a Layer of Diamond Having an Optically Finished (or a Dense) Silicon-Diamond Interface
Application: 17/655,475 →
Publication: US 2022/0205084
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
Assignment of Assignor's Interest Oct 29, 2023
From: XU, WEN-QING; LIU, CHAO; BARBAROSSA, GIOVANNI; ANDERSON, THOMAS E
To: II-VI INCORPORATED
Reel/Frame 065379/0052 →