IP Library › Assignment 065437/0389
Patent Assignment
Reel/Frame 065437/0389

Assignment of Assignor's Interest

Recorded: 2023-11-02 Pages: 3
Assignor
PICOSYS INCORPORATED
Executed: 2018-07-19
Assignee
CORNING INCORPORATED
1 RIVERFRONT PLAZA, CORNING, NEW YORK, 14831
Covered Properties (2)
Methods to dismantle hermetically sealed chambers
Patent: 9,809,019 →
Application: 15/237,953 →
Publication: US 2016/0368258
Chips with Hermetically Sealed but Openable Chambers
Application: 15/237,965 →
Publication: US 2016/0354778
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2023
From: KARAM, RAYMOND M.; WYNNE, THOMAS; CHOBOT, ANTHONY T.
To: PICOSYS INCORPORATED
Reel/Frame 065437/0312 →