Patent Assignment
Reel/Frame 065539/0667
Assignment of Assignor's Interest
Recorded: 2023-11-13
Pages: 4
Assignee
STMICROELECTRONICS (GRENOBLE 2) SAS
12 RUE JULES HOROWITZ, GRENOBLE, 38000, FRANCE
Covered Property
(1)
Chip Package and Its Method of Fabrication
Application:
18/388,927 →
Publication:
US 2024/0162259
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.