Assignment of Assignor's Interest

Recorded: 2023-11-27 Pages: 4

Assignors

CALABRO', SALVATORE PAOLO

Executed: 2023-11-22

PETRUZZA, PIETRO

Executed: 2023-11-22

RAIMONDO, MARTA

Executed: 2023-11-22

Assignee

STMICROELECTRONICS S.R.L.

VIA C. OLIVETTI, 2, AGRATE BRIANZA (MB), 20864, ITALY

Covered Property (1)

Method for Making a Deep Trench Isolation Between High Voltage Semiconductor Devices

Application: 18/519,654 →

Publication: US 2025/0176238

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.