Patent Assignment
Reel/Frame 065834/0045
Assignment of Assignor's Interest
Recorded: 2023-12-11
Pages: 6
Assignees
VERSITECH LIMITED
15/F, K.K. LEUNG BUILDING, THE UNIVERSITY OF HONG KONG, POKFULAM, HONG KONG, CHINA
ADVANCED BIOMEDICAL INSTRUMENTATION CENTRE LIMITED
UNIT 1102, 11/F, BUILDING 17W, 17 SCIENCE PARK WEST AVENUE, HONG KONG, CHINA
Covered Property
(1)
Hybrid Printing of Copper Conductive Material
Application:
18/536,120 →
Publication:
US 2024/0189907
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.