Patent Assignment
Reel/Frame 065862/0790
Assignment of Assignor's Interest
Recorded: 2023-12-13
Pages: 7
Assignors
JEON, OSEOB
Executed: 2023-12-11
IM, SEUNGWON
Executed: 2023-10-22
KIM, JIHWAN
Executed: 2023-10-23
KANG, DONGWOOK
Executed: 2023-10-23
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Molded Power Modules with Fluidic-Channel Cooled Substrates
Application:
18/491,369 →
Publication:
US 2024/0186218