Patent Assignment
Reel/Frame 065869/0206
Assignment of Assignor's Interest
Recorded: 2023-12-14
Pages: 9
Assignors
ZSCHIESCHANG, OLAF
Executed: 2023-12-14
JEON, OSEOB
Executed: 2023-12-11
KIM, JIHWAN
Executed: 2023-10-30
PAUL, ROVEENDRA
Executed: 2023-10-17
NEUMAIER, KLAUS
Executed: 2023-10-19
TEYSSEYRE, JEROME
Executed: 2023-10-19
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Assemblies with Embedded Semiconductor Device Modules and Related Methods
Application:
18/487,835 →
Publication:
US 2024/0128197