Patent Assignment
Reel/Frame 065876/0787
Assignment of Assignor's Interest
Recorded: 2023-12-14
Pages: 5
Assignors
POLOMOFF, NICHOLAS ALEXANDER
Executed: 2023-12-13
HUANG, HUAI
Executed: 2023-12-14
BONAM, RAVI K.
Executed: 2023-12-14
ZHANG, HAOJUN
Executed: 2023-12-13
SAKUMA, KATSUYUKI
Executed: 2023-12-13
FAROOQ, MUKTA GHATE
Executed: 2023-12-13
PERFECTO, ERIC
Executed: 2023-12-13
SKORDAS, SPYRIDON
Executed: 2023-12-13
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Structure for Monitoring Hybrid Bonds in a Semiconductor Chip Package
Application:
18/540,635 →
Publication:
US 2025/0201638