Patent Assignment
Reel/Frame 065965/0995
Assignment of Assignor's Interest
Recorded: 2023-12-27
Pages: 3
Assignors
KIM, JUN HAN
Executed: 2023-12-05
LEE, SEUNG HUN
Executed: 2023-12-05
LEE, SEUNG HYUN
Executed: 2023-12-05
Assignee
YCCHEM CO., LTD.
174-12, YUSEORI-GIL, SEONNAM-MYEON,, SEONGJU-GUN, GYEONGSANGBUK-DO, 40046, KOREA, REPUBLIC OF
Covered Property
(1)
Slurry Composition for Final Polishing of Silicon Wafer for Reducing Number of Surface Defects and Haze and Final Polishing Method Using Same
Application:
18/574,734 →
Publication:
US 2025/0129266