IP Library › Assignment 065986/0696
Patent Assignment
Reel/Frame 065986/0696

Change of Name

Recorded: 2023-12-13 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (2)
Bonded Structures with Integrated Passive Component
Application: 16/298,466 →
Publication: US 2020/0294908
Dimension Compensation Control for Directly Bonded Structures
Application: 17/206,725 →
Publication: US 2021/0296282
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2019
From: HABA, BELGACEM; DELACRUZ, JAVIER A.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 049076/0532 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest Jul 5, 2021
From: GAO, GUILIAN; MIRKARIMI, LAURA WILLS; FOUNTAIN, GAIUS GILLMAN, JR.; UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 056754/0159 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →