Patent Assignment
Reel/Frame 066018/0247
Assignment of Assignor's Interest
Recorded: 2023-12-14
Pages: 6
Assignors
HO, CHUNG HSIUNG
Executed: 2023-11-14
LIU, HUNG MIN
Executed: 2023-11-14
HUANG, WEN LIANG
Executed: 2023-11-14
WU, JENG SIAN
Executed: 2023-11-14
Assignee
PANJIT INTERNATIONAL INC.
NO. 24, GANGSHAN N. RD., GANGSHAN DIST., KAOHSIUNG CITY, 820115, TAIWAN
Covered Property
(1)
Semiconductor Packaging Structure
Application:
18/532,949 →
Publication:
US 2025/0132213