Patent Assignment
Reel/Frame 066026/0504
Assignment of Assignor's Interest
Recorded: 2024-01-04
Pages: 6
Assignors
LO, YU-CHING
Executed: 2023-08-23
YUAN, CHING-PIN
Executed: 2022-08-09
HUANG, WEI-JIE
Executed: 2022-08-09
KUO, CHENG-YU
Executed: 2022-08-09
LEI, YI-YANG
Executed: 2022-08-09
HSIEH, CHING-HUA
Executed: 2022-08-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Workpiece Chuck, Workpiece Handling Apparatus, Manufacturing Method of Semiconductor Package