IP Library Assignment 066389/0686
Patent Assignment
Reel/Frame 066389/0686

Assignment of Assignor's Interest

Recorded: 2024-02-06 Pages: 10
Assignors
LEAR, KELLY M.
Executed: 2021-11-30
MILLER, JEFFREY
Executed: 2021-11-30
ROY, MIHIR
Executed: 2021-11-29
BLAIR, CHRISTINE
Executed: 2021-11-30
Assignee
QORVO US, INC.
7628 THORNDIKE ROAD, GREENSBORO, NORTH CAROLINA, 27409
Covered Property (1)
System in Package with Flip Chip Die Over Multi-Layer Heatsink Stanchion
Application: 18/432,852 →
Publication: US 2024/0178096