Patent Assignment
Reel/Frame 066547/0743
Assignment of Assignor's Interest
Recorded: 2024-02-23
Pages: 7
Assignors
FENG, LEI
Executed: 2024-02-02
WEI, YAMENG
Executed: 2024-02-02
ZHANG, WEI
Executed: 2024-01-22
YAO, WENXING
Executed: 2024-01-15
Assignee
HONOR DEVICE CO., LTD.
SUITE 3401, UNIT A, BUILDING 6, SHUM YIP SKY PARK, NO. 8089, HONGLI WEST ROAD, XIANGMIHU STREET, FUTIAN DISTRICT, GUANGDONG, SHENZHEN, 518040, CHINA
Covered Property
(1)
Foldable Assembly and Electronic Device