Patent Assignment
Reel/Frame 066567/0523
Assignment of Assignor's Interest
Recorded: 2024-02-13
Pages: 70
Assignor
RF360 EUROPE GMBH
Executed: 2023-02-19
Assignee
RF360 SINGAPORE PTE. LTD
80 ROBINSON ROAD #02-00, SINGAPORE, 068898, SINGAPORE
Covered Property
(1)
Wafer Level Package and Method of Manufacture
Application:
18/439,453 →
Publication:
US 2024/0186980
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 13, 2024
From: SCHIEBER, MARKUS
To: RF360 EUROPE GMBH
Reel/Frame 066449/0740 →
Assignment of Assignor's Interest
Mar 6, 2024
From: SCHIEBER, MARKUS
To: RF360 EUROPE GMBH
Reel/Frame 066673/0505 →
Change of Owner's Address
Aug 27, 2024
From: RF360 SINGAPORE PTE. LTD.
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 068788/0486 →