Patent Assignment
Reel/Frame 066635/0368
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2024-03-04
Received: 2024-03-04
Pages: 10
Assignors
IGUCHI, YURI
Executed: 2023-04-26
TAKEUCHI, SHUNYA
Executed: 2023-05-08
MATSUZAKI, MAYUMI
Executed: 2023-05-09
KANG, HYUNJI
Executed: 2023-05-11
Assignees
ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
56, 3-GONGDAN 1-RO, SEOBUK-GU, CHEONAN-SI, CHUNGCHEONGNAM-DO, KRX, 31093, KOREA, REPUBLIC OF
DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
SANNO PARK TOWER 11-1, NAGATA-CHO 2-CHOME, CHIYODA-KU, TOKYO, JPX, 100-6111, JAPAN
Covered Application
(1)
HIGH THIXOTROPIC CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
App. No. 18/593,521
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