Patent Assignment
Reel/Frame 066712/0323
Assignment of Assignor's Interest
Recorded: 2024-03-11
Pages: 3
Assignors
YANG, SHI-YI
Executed: 2019-09-19
LEE, MING-HAN
Executed: 2019-09-19
SHUE, SHAU-LIN
Executed: 2019-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Graphene Barrier Layer of Interconnect Structure
Application:
18/600,197 →
Publication:
US 2024/0213157
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.