Patent Assignment
Reel/Frame 066743/0830
Assignment of Assignor's Interest
Recorded: 2024-03-13
Pages: 5
Assignors
JUN, HO IN
Executed: 2024-01-22
NOH, EON JU
Executed: 2024-01-22
SEO, MYUNG DUK
Executed: 2024-01-22
KIM, KYEONG JUN
Executed: 2024-01-22
KIM, KYO SIK
Executed: 2024-01-22
LEE, DA JEONG
Executed: 2024-01-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component and Substrate with Electronic Component Embedded Therein
Application:
18/601,290 →
Publication:
US 2024/0387110