Patent Assignment
Reel/Frame 066749/0755
Assignment of Assignor's Interest
Recorded: 2024-03-13
Pages: 4
Assignee
TDK CORPORATION
2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN
Covered Property
(1)
Electronic Component Structure with Multilayer Connection Portion
Application:
18/603,515 →
Publication:
US 2024/0321520