Assignment of Assignor's Interest

Recorded: 2024-03-18 Pages: 3

Assignor

YONG, POH HOONG

Executed: 2024-03-07

Assignee

RF360 SINGAPORE PTE. LTD.

9 RAFFLES PLACE, #26-01, REPUBLIC PLAZA, SINGAPORE, 048619, SINGAPORE

Covered Property (1)

Metallization Structure Having an Outer Metallization Layer Comprising Nickel and Platinum Layers to Reduce Inter-Metal Compound Formation

Application: 18/427,155 →

Publication: US 2025/0246568

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.