IP Library › Assignment 066830/0582
Patent Assignment
Reel/Frame 066830/0582

Assignment of Assignor's Interest

Recorded: 2024-03-19 Pages: 4
Assignors
DELACRUZ, JAVIER A.
Executed: 2017-10-27
TEIG, STEVEN L.
Executed: 2017-10-27
HUANG, SHAOWU
Executed: 2017-10-27
PLANTS, WILLIAM C.
Executed: 2017-10-27
FISCH, DAVID EDWARD
Executed: 2017-10-26
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Direct-Bonded Native Interconnects And Active Base Die
Application: 18/379,907 →
Publication: US 2024/0265305
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 19, 2024
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 066833/0712 →
Assignment of Assignor's Interest Mar 19, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: XCELSIS CORPORATION
Reel/Frame 066833/0716 →