Patent Assignment
Reel/Frame 066886/0917
Assignment of Assignor's Interest
Recorded: 2024-03-25
Pages: 7
Assignors
KITAMURA, MASAHIRO
Executed: 2024-03-25
HASHIBA, JUNKI
Executed: 2024-03-25
KAMIMURA, TAKUROH
Executed: 2024-03-25
WATANABE, RYOTA
Executed: 2024-03-25
Assignee
LENOVO (SINGAPORE) PTE. LTD.
151 LORONG CHUAN, #02-01 NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property
(1)
Heat Radiation Structure, Electronic Apparatus, and Method for Manufacturing Same
Application:
18/615,207 →
Publication:
US 2025/0008696