Patent Assignment
Reel/Frame 066937/0932
Assignment of Assignor's Interest
Recorded: 2024-03-28
Pages: 4
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 361-725, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Releasing Semiconductor Chip Package and Method for Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.