IP Library › Assignment 066938/0010
Patent Assignment
Reel/Frame 066938/0010

Assignment of Assignor's Interest

Recorded: 2024-03-28 Pages: 3
Assignors
JEONG, JIN WON
Executed: 2020-07-13
CHOI, JAE SIK
Executed: 2020-07-13
SONG, BYEUNG SOO
Executed: 2020-07-13
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28429, KOREA, REPUBLIC OF
Covered Property (1)
Fabrication Method of Semiconductor Die and Chip-on-Plastic Packaging of Semiconductor Die
Application: 17/747,124 →
Publication: US 2022/0278064
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
Assignment of Assignor's Interest Jul 7, 2025
From: MAGNACHIP MIXED-SIGNAL, LTD.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 071813/0800 →