Patent Assignment
Reel/Frame 067026/0427
Assignment of Assignor's Interest
Recorded: 2024-04-08
Pages: 3
Assignee
KOBELCO RESEARCH INSTITUTE, INC.
1-5-1, WAKINOHAMA-KAIGAN-DORI, CHUO-KU, HYOGO, KOBE-SHI, 651-0073, JAPAN
Covered Property
(1)
Wafer Thickness Measurement Device and Method for Same