IP Library Assignment 067058/0365
Patent Assignment
Reel/Frame 067058/0365

Assignment of Assignor's Interest

Recorded: 2024-04-10 Pages: 6
Assignors
FORAN, HUGH
Executed: 2024-04-09
DECH, JOSHUA
Executed: 2024-04-09
AMANO, NORIYUKI
Executed: 2024-04-09
Assignee
TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
255 REX BLVD., AUBURN HILLS, MICHIGAN, 48326
Covered Property (1)
System and Method of Dielectric Bonding
Application: 17/896,314 →
Publication: US 2023/0074158
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 2, 2025
From: TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
To: STORK HOLDCO INC.
Reel/Frame 071788/0005 →
Security Agreement Jul 3, 2025
From: TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 071815/0728 →
Change of Name Oct 31, 2025
From: TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
To: CSP INNOVATIONS, INC.
Reel/Frame 073593/0669 →
Corrective Assignment to Correct the Conveying Party Data Previously Recorded at Reel: 73593 Frame: 669. Assignor(S) Hereby Confirms the Change of Name. Jan 28, 2026
From: TEIJIN AUTOMOTIVE TECHNOLOGIES, INC.
To: CSP INNOVATIONS, INC.
Reel/Frame 074512/0614 →