Patent Assignment
Reel/Frame 067198/0017
Assignment of Assignor's Interest
Recorded: 2024-04-23
Pages: 5
Assignors
LIN, JING-YI
Executed: 2022-04-25
YANG, CHIH-CHUAN
Executed: 2022-06-06
HSU, KUO-HSIU
Executed: 2022-04-25
HUNG, LIEN-JUNG
Executed: 2022-04-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Test Structure and Test Method Thereof