Patent Assignment
Reel/Frame 067241/0142
Assignment of Assignor's Interest
Recorded: 2024-04-26
Pages: 4
Assignor
PAUL, ROVEENDRA
Executed: 2023-08-23
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Sealing Method for Direct Liquid Cooled Power Electronics Package
Application:
18/364,330 →
Publication:
US 2024/0064944