Patent Assignment
Reel/Frame 067324/0163
Assignment of Assignor's Interest
Recorded: 2024-05-06
Pages: 4
Assignors
LEE, CHANG WOO
Executed: 2024-04-25
PARK, ILDO
Executed: 2024-04-25
HWANG, MYUNG HYUN
Executed: 2024-04-25
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE LTD
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property
(1)
Apparatus, Device, and Method for Adapting Sensitivity of Electrode Pairs in a Mutual Capacitance Sensing Grid
Application:
18/655,933 →
Publication:
US 2025/0341912
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.