Patent Assignment
Reel/Frame 067347/0448
Assignment of Assignor's Interest
Recorded: 2024-05-08
Pages: 7
Assignor
WANG, HAO-YU
Executed: 2024-05-07
Assignee
LENOVO (SINGAPORE) PTE. LTD.
151 LORONG CHUAN, #02-01 NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property
(1)
Heat Sink, Cooling Module, Electronic Apparatus, and Method of Manufacturing Heat Sink
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 26, 2022
From: WANG, HAO-YU; UCHINO, AKINORI; OHYAMA, ATSUSHI
To: LENOVO (SINGAPORE) PTE. LTD.
Reel/Frame 060027/0542 →
Assignment of Assignor's Interest
Feb 20, 2025
From: LENOVO (SINGAPORE) PTE LTD.
To: LENOVO PC INTERNATIONAL LIMITED
Reel/Frame 070269/0077 →
Assignment of Assignor's Interest
Feb 20, 2025
From: LENOVO PC INTERNATIONAL LIMITED
To: LENOVO SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 070269/0092 →