Patent Assignment
Reel/Frame 067567/0378
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 38378 FRAME: 427. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME.
Recorded: 2024-05-30
Received: 2024-05-30
Pages: 10
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, SINGAPORE
Covered Applications
(8)
Semiconductor Device Having a Vertical Interconnect Structure Using Stud Bumps
App. No. 13/446,863
→
INTEGRATING DATA FROM SYMMETRIC AND ASYMMETRIC MEMORY
App. No. 13/443,121
→
Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component
App. No. 13/438,696
→
Semiconductor Device and Method of Stacking Die on Leadframe Electrically Connected by Conductive Pillars
App. No. 13/430,538
→
SEMICONDUCTOR DEVICE AND METHOD OF FORMING A VERTICAL INTERCONNECT STRUCTURE FOR 3-D FO-WLCSP
App. No. 13/191,318
→
Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance
App. No. 13/107,075
→
Semiconductor Device and Method of Forming Leadframe With Notched Fingers for Stacking Semiconductor Die
App. No. 13/069,191
→
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
App. No. 12/714,190
→