IP Library Assignment 067601/0952
Patent Assignment
Reel/Frame 067601/0952

Assignment of Assignor's Interest

Recorded: 2024-06-03 Pages: 3
Assignors
PANDYA, BHARGAV
Executed: 2023-12-22
CHEAH, CHUAN
Executed: 2023-12-22
Assignee
INFINEON TECHNOLOGIES AMERICAS CORP.
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property (1)
Semiconductor Package with Heat Flow Restricting Connector
Application: 18/407,918 →
Publication: US 2025/0226351
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2024
From: VORWERK, MANUEL
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 067602/0243 →
Assignment of Assignor's Interest Feb 20, 2025
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 070269/0912 →