Patent Assignment
Reel/Frame 067770/0074
Assignment of Assignor's Interest
Recorded: 2024-06-19
Pages: 7
Assignors
BARTELDS, JAN TEUN
Executed: 2023-03-21
HJORTNAES, THOMAS
Executed: 2023-03-29
BLAAUW, JURJEN BATE
Executed: 2023-03-16
IDEMA, SJOERD
Executed: 2023-03-08
Assignee
BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.
INSTITUTENWEG 25A, ENSCHEDE, 7521 PH, NETHERLANDS
Covered Property
(1)
Extrusion Based Additive Manufacturing Apparatus Having a Temperature Sensor in the Vicinity of the Printhead
Application:
18/721,749 →
Publication:
US 2024/0416591
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.