Patent Assignment
Reel/Frame 067784/0722
Assignment of Assignor's Interest
Recorded: 2024-06-20
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Integrated Circuit and Method for Forming the Same