Patent Assignment
Reel/Frame 067834/0677
Assignment of Assignor's Interest
Recorded: 2024-06-25
Pages: 6
Assignors
ALLEGATO, GIORGIO
Executed: 2024-06-04
FERRARI, PAOLO
Executed: 2024-05-30
OGGIONI, LAURA
Executed: 2024-06-03
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY
Covered Property
(1)
Microelectromechanical Sensor Device with Wafer-Level Integration of Pressure and Inertial Detection Structures and Corresponding Manufacturing Process
Application:
18/745,739 →
Publication:
US 2025/0002332
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.